產品

E7L系列H610平臺 嵌入式工控機/BOX

E7L系列H610平臺 嵌入式工控機/BOX

特點:

  • 支持Intel? 12/13th Gen Core / Pentium/ Celeron Desktop CPU, TDP 35W, LGA1700
  • 搭配Intel? H610芯片組
  • 2個Intel網絡接口 (1 * 1GbE&1 * 2.5GbE)
  • 3路顯示輸出 HDMI,DP++和內部LVDS, 最高支持4K@60Hz分辨率
  • 豐富的USB、串口擴展接口和PCIe、mini PCIe、M.2擴展插槽
  • 無風扇被動式散熱

  • 遠程管理 遠距離管理系統
  • 狀態監控 的狀態管控
  • 遠程運維 qq遠程維護
  • 安全控制 安全防護有效控制
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產品描述

阿普奇置于式工(gong)(gong)控設(she)備機(ji)E7L系列H610平(ping)臺是一款高(gao)效、可靠的(de)(de)(de)(de)嵌入(ru)式工(gong)(gong)控機(ji),專(zhuan)為工(gong)(gong)業自動(dong)化和(he)邊緣(yuan)計(ji)(ji)算(suan)應用(yong)(yong)而(er)設(she)計(ji)(ji)。運(yun)用(yong)(yong)不支(zhi)持(chi)(chi)(chi)Intel? 12/13th Gen Core / Pentium/ Celeron Desktop CPU,這(zhe)些處理器具有35W的(de)(de)(de)(de)TDP和(he)LGA1700封裝(zhuang),提(ti)供(gong)了強大(da)的(de)(de)(de)(de)性能(neng)和(he)能(neng)效,滿(man)足(zu)各(ge)種(zhong)工(gong)(gong)業環境下的(de)(de)(de)(de)穩(wen)定(ding)(ding)運(yun)行。H610芯片組提(ti)供(gong)穩(wen)定(ding)(ding)的(de)(de)(de)(de)硬件平(ping)臺,支(zhi)持(chi)(chi)(chi)多(duo)種(zhong)擴(kuo)展(zhan)功(gong)能(neng)。2個千兆網絡接(jie)(jie)(jie)口(kou)(kou)確(que)保高(gao)速穩(wen)定(ding)(ding)的(de)(de)(de)(de)網絡連(lian)接(jie)(jie)(jie),滿(man)足(zu)大(da)數據傳輸需求(qiu)。3路顯(xian)示輸出支(zhi)持(chi)(chi)(chi)高(gao)清(qing)晰(xi)度(du)顯(xian)示,最高(gao)支(zhi)持(chi)(chi)(chi)4K@60Hz分(fen)辨率。豐富的(de)(de)(de)(de)USB、串口(kou)(kou)擴(kuo)展(zhan)接(jie)(jie)(jie)口(kou)(kou)和(he)PCIe、mini PCIe、M.2擴(kuo)展(zhan)插槽可根據具體應用(yong)(yong)需求(qiu)進行定(ding)(ding)制配置。無風扇被動(dong)式散(san)熱設(she)計(ji)(ji)確(que)保系統散(san)熱效果優良,提(ti)升運(yun)行可靠性。

自始至終(zhong),阿普奇E7L款型H610系統植入式(shi)企業智能(neng)化機(ji)驅使漂(piao)亮的(de)功能(neng)和豐富多彩的(de)模塊,為企業智能(neng)化和非(fei)核心計算公式(shi)給(gei)出(chu)了很強鼓勵(li),滿足了不(bu)同的(de)簡化選用不(bu)一樣的(de)要(yao)。

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Model

E7L

E7DL

CPU

CPU Intel? 12/13th Generation Core / Pentium/ Celeron Desktop CPU
TDP 35W
Socket LGA1700
Chipset H610
BIOS AMI 256 Mbit SPI

Memory

Socket 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 3200MHz
Max Capacity 64GB, Single Max. 32GB

Graphics

Controller Intel??UHD Graphics

Ethernet

Controller 1 * Intel i219-LM/V 1GbE LAN Chip (LAN1, 10/100/1000 Mbps)
1 * Intel i225-V/LM 2.5GbE LAN Chip (LAN2, 10/100/1000/2500 Mbps)

Storage

SATA 1 * SATA3.0, quick release 2.5-inch hard drive bay (T ≤ 7mm)
1 * SATA3.0, Internal 2.5" hard disk bays (T≤9mm, Optional)
M.2 1 * M.2 Key-M (SATA3.0, 2280)

Expansion Slots

PCIe Slot N/A ①: 1 * PCIe x16 (x16)②: 2 * PCI

PS: ①、②One out of two, Expansion card length ≤ 185mm, TDP ≤ 130W

aDoor 1 * aDoor Bus (Optional 4 * LAN/4 * POE/6 * COM/16 * GPIO expansion card)
Mini PCIe 1 * Mini PCIe (PCIe3.0 x1 + USB 2.0, with 1*Nano SIM Card)

Front I/O

Ethernet 2 * RJ45
USB 2 * USB3.2 Gen2x1(Type-A, 10Gbps)
2 * USB3.2 Gen1x1(Type-A, 5Gbps)
2 * USB2.0 (Type-A)
Display 1 * HDMI1.4b: max resolution up to 4096*2160 @ 30Hz
1 * DP1.4a: max resolution up to 4096*2160 @ 60Hz
Audio 2 * 3.5mm Jack (Line-Out + MIC)
Serial 2 * RS232/422/485 (COM1/2, DB9/M, Full Lanes, BIOS Switch)
2 * RS232 (COM3/4, DB9/M, Full Lanes)
Button 1 * Power Button + Power LED
1 * AT/ATX Button
1 * OS Recover Button
1 * System Reset Button

Rear I/O

Antenna 4 * Antenna hole
SIM 1* Nano SIM card slot (SIM1)

Internal I/O

USB 6 * USB2.0 (wafer)
LCD 1 * LVDS (wafer): max resolution up to 1920*1200 @ 60Hz
Front Panel 1 * FPanel (PWR + RST + LED, wafer)
Audio 1 * Audio (Header)
1 * Speaker (2-W (per channel)/8-Ω Loads, wafer)
Serial 2 * RS232 (COM5/6, wafer)
GPIO 1 * 16 bits DIO (8xDI and 8xDO, wafer)
LPC 1 * LPC (wafer)
SATA 3 * SATA 7P Connector, up to 600MB/s
SATA Power 3 * SATA Power (wafer)
FAN 1 * CPU FAN (wafer)
2 * SYS FAN (KF2510-4A)

Power Supply

Type DC, AT/ATX
Power Input Voltage 9~36VDC, P≤240W
18~60VDC, P≤400W
Connector 1 * 4Pin Connector, P=5.00/5.08
RTC Battery CR2032 Coin Cell

OS Support

Windows Windows 10/11
Linux Linux

Watchdog

Output System Reset
Interval Programmable 1 ~ 255 sec

Mechanical

Enclosure Material Radiator: Aluminum alloy, Box: SGCC
Dimensions 268mm(L) * 194.2mm(W) * 67.7mm(H) 268mm(L) * 194.2mm(W) * 118.5mm(H)
Weight Net: 4.5 kgTotal: 6 kg (Include packaging) Net: 4.7kgTotal: 6.2 kg (Include packaging)
Mounting VESA, Wall mounted, Desktop

Environment

Heat Dissipation System Fanless Passive Cooling
Operating Temperature -20 ~ 60℃?(Industrial SSD)
Storage Temperature -40 ~ 80℃?(Industrial SSD)
Relative Humidity 10 to 90% RH (non-condensing)
Vibration During Operation With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis)
Shock During Operation With SSD: IEC 60068-2-27 (30G, half sine, 11ms)
Certification CE/FCC, RoHS

E7L

  • 嵌入式工控機/BOX E7L系列H610平臺

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