阿普奇無(wu)人化吊車操作器TAC-3000是一款專為(wei)無(wu)人叉應用(yong)(yong)(yong)而(er)設計的(de)(de)(de)(de)高(gao)性能(neng)AI控(kong)(kong)制(zhi)器。TAC-3000采(cai)用(yong)(yong)(yong)NVIDIA Jetson TMS O-DIMM連接(jie)器核(he)心板,支持高(gao)性能(neng)的(de)(de)(de)(de)AI計算,最高(gao)可達(da)100TOPS算力。能(neng)夠滿足機器人應用(yong)(yong)(yong)中對強(qiang)大計算能(neng)力的(de)(de)(de)(de)需(xu)(xu)求的(de)(de)(de)(de)還做到(dao)高(gao)一級能(neng)效和低輸(shu)出功率(lv)。鎖定板載(zai)3個千兆網絡(luo)接(jie)口和4個USB3.0接(jie)口,提供高(gao)速穩(wen)定的(de)(de)(de)(de)網絡(luo)連接(jie)和數據(ju)傳輸(shu)能(neng)力。支持軟(ruan)件多類(lei)擴(kuo)充功效,涉及到(dao)可以的(de)(de)(de)(de)16位(wei)DIO、2個RS232/RS485可配置COM接(jie)口等,靈活配置外(wai)部設備(bei)連接(jie)。一并兼容5G/4G/WiFi功能(neng)擴(kuo)展(zhan),提供穩(wen)定的(de)(de)(de)(de)無(wu)線通信(xin)連接(jie),確保機器人在不(bu)同環(huan)境(jing)下(xia)都能(neng)夠保持通信(xin)暢通。支持DC 12~28V寬壓(ya)輸(shu)入,適應不(bu)同的(de)(de)(de)(de)電源環(huan)境(jing)。采(cai)用(yong)(yong)(yong)無(wu)風扇超(chao)緊湊(cou)設計,全金屬(shu)高(gao)強(qiang)度機身(shen),能(neng)夠適應各(ge)種惡(e)劣的(de)(de)(de)(de)環(huan)境(jing)條件,促使(shi)調(diao)控(kong)(kong)器并能(neng)使(shi)用(yong)(yong)(yong)在各(ge)式各(ge)樣窄小(xiao)的(de)(de)(de)(de)辦公(gong)空間(jian)(jian)內。同一時間(jian)(jian),TAC-3000還支持桌面式和DIN安裝方(fang)式,可根(gen)據(ju)實際(ji)應用(yong)(yong)(yong)需(xu)(xu)求進行安裝部署。
上(shang)面總的(de)來(lai)說(shuo),阿普奇(qi)無人化堆高(gao)車調(diao)節(jie)器(qi)TAC-3000憑借其強大的(de)AI算(suan)力、高(gao)速網絡連接(jie)、豐(feng)富的(de)I/O接(jie)口和卓(zhuo)越的(de)擴展性能,為(wei)無人叉車應用提供了穩定、高(gao)效的(de)支持。
Model | TAC-3000 | ||||
Processor System | SOM | Nano | TX2 NX | Xavier NX | Xavier NX 16GB |
AI Performance | 472 GFLOPS | 1.33 TFLOPS | 21 TOPS | ||
GPU | 128-core NVIDIA Maxwell??architecture GPU | 256-core NVIDIA Pascal??architecture GPU | 384-core NVIDIA Volta??architecture GPU with 48 Tensor Cores | ||
GPU Max Frequency | 921MHz | 1.3 GHz | 1100 MHz | ||
CPU | Quad-core?ARM??Cortex?-A57?MPCore processor | Dual-core?NVIDIA DenverTM?2?64-bit?CPU
and?quad-core?Arm??Cortex?-A57 MPCore processor |
6-core NVIDIA Carmel Arm? v8.2 64-bit CPU
?6MB L2 + 4MB L3 |
||
CPU Max Frequency | 1.43GHz | Denver 2: 2 GHz
Cortex-A57: 2 GHz |
1.9 GHz | ||
Memory | 4GB?64-bit?LPDDR4 25.6GB/s | 4GB?128-bit?LPDDR4 51.2GB/s | 8GB?128-bit?LPDDR4x 59.7GB/s | 16GB?128-bit?LPDDR4x 59.7GB/s | |
TDP | 5W-10W | 7.5W - 15W | 10W - 20W | ||
Processor System | SOM | Orin Nano 4GB | Orin Nano 8GB | Orin NX 8GB | Orin NX 16GB |
AI Performance | 20 TOPS | 40 TOPS | 70 TOPS | 100 TOPS | |
GPU | 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores | 1024-core NVIDIA Ampere architecture GPU
with 32 Tensor Cores |
1024-core NVIDIA Ampere architecture GPU
with 32 Tensor Cores |
||
GPU Max Frequency | 625 MHz | 765 MHz | 918 MHz | ? | |
CPU | 6-core Arm??Cortex??A78AE v8.2 64-bit CPU
1.5MB L2 + 4MB L3 |
6-core Arm??Cortex??A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | 8-core Arm??Cortex??A78AE v8.2 64-bit CPU?2MB L2 + 4MB L3 | ||
CPU Max Frequency | 1.5 GHz | 2 GHz | |||
Memory | 4GB 64-bit LPDDR5 34 GB/s | 8GB 128-bit LPDDR5 68 GB/s | 8GB 128-bit LPDDR5 102.4 GB/s | 16GB 128-bit LPDDR5 102.4 GB/s | |
TDP | 7W - 10W | 7W - 15W | 10W - 20W | 10W - 25W | |
Ethernet | Controller | 1 * GBE LAN Chip (LAN signal from System-on-Module), 10/100/1000 Mbps
2 * Intel??I210-AT, 10/100/1000 Mbps |
|||
Storage | eMMC | 16GB eMMC 5.1 (Orin Nano and Orin NX SOMs do not support eMMC) | |||
M.2 | 1 * M.2 Key-M (NVMe SSD, 2280) (Orin Nano and Orin NX SOMs is PCIe x4 signal, while other SOMs is PCIe x1 signal) | ||||
TF Slot | 1 * TF Card Slot (Orin Nano and Orin NX SOMs do not support TF Card) | ||||
Expansion
Slots |
Mini PCIe | 1 * Mini PCIe Slot (PCIe x1+USB 2.0, with 1 * Nano SIM Card) (Nano SOM do not have PCIe x1 signal) | |||
M.2 | 1 * M.2 Key-B Slot (USB 3.0, with 1 * Nano SIM Card, 3052) | ||||
Front I/O | Ethernet | 2 * RJ45 | |||
USB | 4 * USB3.0 (Type-A) | ||||
Display | 1 * HDMI: Resolution up to 4K @ 60Hz | ||||
Button | 1 * Power Button + Power LED 1 * System Reset Button |
||||
Side I/O | USB | 1 * USB 2.0 (Micro USB, OTG) | |||
Button | 1 * Recovery Button | ||||
Antenna | 4 * Antenna hole | ||||
SIM | 2 * Nano SIM | ||||
Internal I/O | Serial | 2 * RS232/RS485 (COM1/2, wafer, Jumper Switch)
1 * RS232/TTL (COM3, wafer, Jumper Switch) |
|||
PWRBT | 1 * Power Button (wafer) | ||||
PWRLED | 1 * Power LED (wafer) | ||||
Audio | 1 * Audio (Line-Out + MIC, wafer)
1 * Amplifier, 3-W (per channel) into a 4-Ω Loads (wafer) |
||||
GPIO | 1 * 16 bits DIO (8xDI and 8xDO, wafer) | ||||
CAN Bus | 1 * CAN (wafer) | ||||
FAN | 1 * CPU FAN (wafer) | ||||
Power Supply | Type | DC, AT | |||
Power Input Voltage | 12~28V DC | ||||
Connector | Terminal block, 2Pin, P=5.00/5.08 | ||||
RTC Battery | CR2032 Coin Cell | ||||
OS Support | Linux | Nano/TX2 NX/Xavier NX: JetPack 4.6.3
Orin Nano/Orin NX: JetPack 5.3.1 |
|||
Mechanical | Enclosure Material | Radiator: Aluminum alloy, Box: SGCC | |||
Dimensions | 150.7mm(L) * 144.5mm(W) * 45mm(H) | ||||
Mounting | Desktop、DIN-rail | ||||
Environment | Heat Dissipation System | Fan less design | |||
Operating Temperature | -20~60℃?with 0.7 m/s airflow | ||||
Storage Temperature | -40~80℃ | ||||
Relative Humidity | 10 to 95% (non-condensing) | ||||
Vibration | 3Grms@5~500Hz, random, 1hr/axis (IEC 60068-2-64) | ||||
Shock | 10G, half sine, 11ms (IEC 60068-2-27) |
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